Single Event Induced Crosstalk of Monolithic 3D Circuits Based on a 22 nm FD-SOI Technology

Junjun Zhang,Fanyu Liu,Bo Li,Yang Huang,Siyuan Chen,Yuchong Wang,Jiajun Luo,Jing Wan

2022 IEEE International Reliability Physics Symposium (IRPS)（2022）

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摘要

The single event induced crosstalk of monolithic 3D (M3D) integrated inverter chain is investigated using GEANT4 and TCAD simulations from layout, spacing, length, supply voltage and transistor size. The accurate ionization profiles are initially obtained and modelled in TCAD. Meanwhile, the crosstalk capacitances between interconnect lines or transistors are acquired through 3D simulation. Result...

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关键词

Solid modeling,Three-dimensional displays,Layout,Crosstalk,Voltage,Logic gates,Inverters

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