System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents

2022 IEEE International Reliability Physics Symposium (IRPS)(2022)

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摘要
A physics-based system-level electromigration (EM) modelling platform is employed to simulate EM and its impact on the IR drop from the supply voltage to the standard-cells for a power delivery network design in a 3 nm logic node. The simulated PDN elicited high EM-tolerance. Despite EM voiding in multiple PDN segments, the EM induced IR-drop increase at the standard-cell level stayed below 3.3% w...
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关键词
Rails,Electromigration,Semiconductor device modeling,Tensile stress,Ruthenium,Termination of employment,Voltage
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