On the initial stages and growth process of intermetallic compounds at Cu/Sn interface: A MD simulation and experimental study
SSRN Electronic Journal(2022)
摘要
•A model of nucleation and growth of intermetallic compounds during welding was proposed.•The diffusion coefficient decreases exponentially during the nucleation and growth of intermetallic compounds until thin layers are formed.•The diffusion patterns between matrix and different intermetallic compounds are different.
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关键词
Molecular dynamics,Nucleation process
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