Near Volatile and Non-Volatile Memory Processing in 3D Systems

IEEE Transactions on Emerging Topics in Computing(2022)

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摘要
The cost of transferring data between the off-chip memory system and compute unit is the fundamental energy and performance bottleneck in modern computing systems. Furthermore, with the advent of emerging data-intensive applications and technology scaling, this bottleneck has continuously increased. To overcome these difficulties, Near Memory Processing (NMP) based on 3D die stacking becomes a potential technology to transform the computation-centric system towards memory-centric system. In this work, we explore the feasibility and efficacy of a NMP architecture based on an emerging Non-Volatile Memory technology (NVM) for data-intensive applications and compare it with the conventional 3D-stacked NMP architecture based on DRAM. We demonstrate the effectiveness of our approach with experimental results.
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关键词
Near memory processing,data-intensive applications,3D-stacked memory technologies,emerging non-volatile memory technologies
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