IC Solder Joints Inspection via an Optimized Statistical Modeling Method

Wenjie Chen,Nian Cai,Zhiliang Wu,Han Wang, Jing Ma

IEEE Transactions on Components, Packaging and Manufacturing Technology（2022）

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摘要

To ensure the qualities of integrated circuit (IC) solder joints, a novel inspection method is proposed based on optimized statistical modeling. Compared to the previous visual background extraction (ViBe) inspection method, our method utilizes more ViBe templates to train the statistical model via qualified IC solder joints. Then, several similar templates are selected from these ViBe templates v...

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关键词

Soldering,Integrated circuit modeling,Inspection,Training,Light emitting diodes,Manufacturing,Feature extraction

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