Design of 900 GHz Microstrip-Waveguide Probe

Yansheng Hu, Guoyong Ning,Meng Zhang,Shuoxing Li, Jidong Yin,Han Wang

2021 6th International Conference on Integrated Circuits and Microsystems (ICICM)(2021)

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摘要
To meet the need for highly integrated coupling technology for terahertz system-in-package, the design of a 900 GHz microstrip-waveguide probe based on GaAs is presented in this paper. The probe with fine airtightness is composed of two $25 \mu \mathrm{m}$ GaAs substrates with metallization vias. The total thickness of the probe is less than $60 \mu \mathrm{m}$, which makes it suitable to be appli...
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关键词
Couplings,System-in-package,Waveguide components,Simulation,Gallium arsenide,Insertion loss,Microstrip
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