Influence of process layouts of multi-roll solid-liquid cast-rolling bonding process on circumferential performance uniformity during fabricating metal cladding materials

Journal of Materials Processing Technology(2022)

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摘要
The twin-roll casting (TRC) process is typically used to fabricate laminated metal cladding strips with rectangular cross-sections, and it has the advantages of short flow, low energy consumption, green environmental protection, etc. Recently, a twin-roll solid-liquid cast-rolling bonding (TRSLCRB) process was proposed based on the TRC process to fabricate metal cladding materials with round cross-sections. However, the nonuniformity of heat transfer and mass transfer along the circumferential direction finally influences the performance uniformity. Therefore, a multi-roll solid-liquid cast-rolling bonding (MRSLCRB) process was proposed integrating cast-rolling bonding technology and multi-roll groove rolling technology. The steady-state thermal resistance network was established, and the influences of nominal roll radius, groove radius, and molten pool height on the heat transfer and mass transfer were studied systematically. 3-D steady-state thermal-fluid coupled simulation models of twin-roll, three-roll, and four-roll layouts were established. The results indicate that increasing casting roll number can improve the nominal cast-rolling velocity, service life of the casting roll, temperature uniformity, strain uniformity, and strain rate uniformity through regulating the heat transfer and mass transfer. Considering the manufacturing feasibility, the MRSLCRB equipment based on the three-roll layout was designed. Cu/steel cladding bars with uniform circumferential performance were fabricated, and the forming mechanism was revealed. The multi-field coupled analysis method provides a way to control heat and mass transfer uniformity, and the successful attempts of various typical metal cladding materials inspire exploring new forming processes.
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关键词
Metal cladding materials,Twin-roll casting (TRC),Solid-liquid bonding,Heat transfer and mass transfer,Forming mechanism
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