Improving tomographic sensing of Scalpel SPM with multi-probe functionality and automatic removal rate extraction

C. O’Sullivan, M. Tedaldi, C. Drilakis,T. Hantschel, A. D. L. Humphris, J. P. Hole, J. Goulden,U. Celano

2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)（2021）

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摘要

We report on the use of a multi-probe sensing scheme for the implementation of tomographic atomic force microscopy. This leverages the use of three independent probes, alternating their operation on the same area of the sample surface, thus enabling fast tip replacement and high-resolution imaging. Here, two areas of improvement are discussed, namely (1) the development of a synchronized multi-pro...

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关键词

Integrated circuits,Automation,Scanning probe microscopy,High-resolution imaging,Switches,Tomography,Hardware

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