Novel Phased Array Antenna-in-Package Development and Active Module Demonstration for 5G Millimeter-Wave Wireless Communication

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)(2021)

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摘要
This paper presents novel antenna designs and integration methods that enable a low-cost scalable antenna-in-package (AiP) phased-array solution for wideband wireless communication covering 24 Glitz - 30 GHz (N257, N258 and N261 5G bands). A total number of 26 dual-polarized antenna variants based on two implementation approaches were fabricated on a 47.5mm x47.5mm package test vehicle with an element-to-element pitch of 5.9 nun. The first approach consists of integrating a magneto-electric dipole antenna array in a single laminate and the second approach consists of an aperture-coupled patch antenna array implemented in a superstrate forming a 2-laminate structure. Passive measurement results demonstrate the feasibility of achieving more than 5GHz input return loss bandwidth and 7dBi peak antenna gain with over 20d11 cross-polarization isolation at 28 GHz, as well as near-identical radiation patterns for both H and V polarizations. In addition, the AiP test vehicle contains two 4x4 antenna arrays (one for each design approach) that support integration with 28-GHz SiGe phased array RFICs for active testing. Over-the-air active module measurement results are reported, including near-ideal spatial power combining, antenna gain uniformity across elements within +/-2.5dB, as well as 16-element beam-forming and beam-steering in a +/- 60 degrees range.
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关键词
Antenna array, antenna-in-package, phased array, magneto-electric antenna, ball grid array, beamforming, dual polarization, 5G, flip-chip device, millimeter wave, multichip module (MCM), organic buildup substrate, wireless communication
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