Siox Patterned Based Substrates Implemented In Cu(In,Ga)Se-2 Ultrathin Solar Cells: Optimum Thickness

2021 IEEE 48TH PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC)(2021)

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摘要
Interface recombination in sub-mu m optoelectronic devices has a major harmful impact in devices performance, showing the need for tailored passivation strategies in order to reach a technological boost. In this work, SiOx based substrates were developed and integrated in ultrathin CIGS solar cells. This study aims at understanding the impact of several SiOx layer thicknesses (3, 8 and 25 nm) when this material is used as a passivation layer. Analysing their electrical parameters, the 8 nm novel SiOx based substrates achieved light to power conversion efficiency values up to 13.2 %, a 1.3 % absolute improvement over the conventional substrate (without SiOx).
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关键词
Cu(In,Ga)Se-2, SiOx, Rear Passivation Strategy
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