Integration Of V-Band And W-Band Antennas With Spdt Switch On Fan-Out Wafer Level Packaging (Fowlp)

This paper presents the integration of V-band and W-band antennas with SPDT switch on fan-out wafer level packaging (FOWLP) with a compact size of 16.10.0.35 mm(3). A wide band chip to package transition is designed on redistribution layers (RDLs) to minimize the insertion loss between chip and antennas. Microstrip grid array antennas are designed and optimized at 60 GHz and 80 GHz. The antennas are fed by chip signal which is coupled through a slot in the ground plane. The simulation results show 10-dB impedance bandwidth of 9 GHz and 7.2 GHz for V-band and W-band, respectively, and maximal peak realized gain of 12.84 dBi and 14.42 dBi for V-band and W-band, respectively.