Improved router & server OPEX, acoustics and leakage power through advancements in ASIC / CPU design

Increasing thermal demands for high-end server CPUs and Router/Switch ASICs require increased performance for the air-cooled system thermal design in order to meet increasing industry needs. Improving the CPU/ASIC package thermal performance is one of the critical areas for improving multiple system level thermal design issues. This includes (a) increasing the maximum CPU/ASIC power; (b) reducing the leakage power dissipation and associated OPEX through attaining a lower junction temperature; (c) lowering OPEX by being able to reduce air flow requirements and associated power required for the air movers; and (d) reducing the server OSHA sound pressure level, along with reducing the router/switch NEBS acoustic sound power level due to realizing a lower air flow requirement.