Challenges in Design and Modeling of Cold CMOS HPC Technology

Victor Moroz,Jamil Kawa,Xi-Wei Lin,Andrew R. Brown,Plamen Asenov,Jaehyun Lee,Mohit Bajaj, Tyler Michalak,Craig Riddet,Alexei Svizhenko, Renato Hentschke,Søren Smidstrup

2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)（2021）

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摘要

There are two fundamental trends observed in HPC (High Performance Computing) server farms that are becoming increasingly worrying. One is that their power consumption is becoming a major concern [1]. Another is that there is an increasing percentage of transistors on the chip that cannot be used simultaneously due to overheating. This is often referred to as dark silicon [2] (Fig. 1).

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关键词

Silicon compounds,Power demand,Temperature,Aluminum,Tin,FinFETs,Density functional theory

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