Contact module progress and challenges in advanced CMOS technologies

2021 IEEE International Interconnect Technology Conference (IITC)(2021)

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摘要
In this invited paper, we demonstrate that the contact interface resistance is a major bottleneck for advanced FinFET performance scaling (38% of the external resistance at 45nm gate pitch). After analyzing the key components defining the contact interface resistivity (active doping level, Schottky barrier height, contact area), we review the engineering techniques available to improve this critic...
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关键词
Resistance,Silicides,Conferences,Schottky barriers,Doping,Conductivity,Logic gates
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