Interconnect Technology/System Co-Optimization for Low-Power VLSI Applications Using Ballistic Materials
IEEE Transactions on Electron Devices(2021)
摘要
Promising interconnect materials continue to emerge and are considered as potential replacements for Cu interconnects. In this article, an interconnect technology/system codesign methodology is presented to efficiently optimize generic interconnects using ballistic materials. The key requirements of material-level characteristics to replace conventional Cu counterparts are quantified, such as the ...
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关键词
Integrated circuit interconnections,Wires,Graphene,Resistance,Delays,Quantum capacitance,Contact resistance
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