Tooling And Procedures For Hybrid Integration Of Lasers By Flip-Chip Technology

A method of achieving hybrid integration of laser bars on a silicon platform, using chip-flip bonding, is presented. A support structure etched into the substrate is used to provide vertical alignment to the plane utilizing a gimballed placement laser tool. In-plane accuracy is provided by bonder tolerances, with facet-to-facet alignment enabled by high magnification optics and the dimensions of the laser bar. Chip design features have increased allowed tolerances during fabrication of the support structure giving a route to higher yield in manufacture.