Multi-port Power Combining Grid Array Antenna on Fan-out Wafer Level Packaging

This paper presents multi-port power combining grid array antenna on fan-out wafer level packaging (FOWLP). The size of the package is 9 x 9 x 0.35 mm3. The microstrip grid array antenna is chosen as the multi-port antenna radiator. The antenna shows high design flexibility. The feeding port are set symmetrically on the cross points of the short sides and long sides and are fed differentially. The distance of the ports are determined by the chip size. A four port microstrip grid array antenna is integrated with a chip of 3×3×0.1 mm3. The simulation results show the maximal peak realized gain is 14.75 dBi and the -10 dB input impedance bandwidth is 13.9 GHz.