Temperature cycle reliability analysis and life prediction of plastic encapsulated power semiconductor devices

Discrete devices play an irreplaceable role in the power semiconductor circuit, and are the most mainstream power semiconductor devices. Aiming at the reliability problem of a typical plastic encapsulated power semiconductor device exposed to GJB 7400-2011 standard temperature cycling test, this paper analyzes the stress and strain behavior of the device in the temperature cycle. Life prediction is carried out to study the influence of packaging structure and packaging material on its life. In addition, the solder overflow in the package process is analyzed and optimized.