Temperature Hysteresis Effect of Q-factor in Vacuum Packaged MEMS Device

Vacuum packaging technology is commonly used in MEMS device to improve performance. Yet, the temperature influence of vacuum packaging on the MEMS device is rarely studied. In this paper, temperature hysteresis effect of Q-factor in vacuum packaged MEMS device was studied. The experimental test was carried out, and the mechanism was also investigated. Four kinds of MEMS gyroscope with different pressure were designed, and their temperature characteristic of Q-factor were measured. The results show that the packaged pressure influences the temperature hysteresis of Q-factor greatly, and lower pressure packaging would cause larger temperature hysteresis of Q-factor. This study is helpful for designer to understand the influence of vacuum packaging and improve temperature performance for vacuum packaged MEMS device.