Novel Dual Curing Process for a Stereolithographically Printed Part Triggers A Remarkably Improved Interlayer Adhesion and Excellent Mechanical Properties.

Stereolithography (SL) is widely used because of its numerous advantages over other three-dimensional printing (3DP) techniques. However, SL is a layer-by-layer process, where interlayer adhesion between adjacent layers becomes more brittle than the intralayer adhesion, common to all 3DP process. Here, we report a facile method to strengthen the interlayer adhesion for SL. By the addition of monomers with thermally curable functional groups (epoxy or hydroxyl groups), thermal post-curing induces chemical reactions between them in adjacent layers after the photoinitiated printing process. It leads to fully 3D cured objects with enhanced interlayer bonding and substantially improved mechanical properties, but not a significant change in the dimensional stability. This approach can expand the use of 3DP techniques in load-bearing applications that require mechanically robust printed objects with precise dimensions.