3 D stacked image sensor featuring low noise inductive coupling channels

Abstract This paper proposes 3D stacked module consisting of image sensor and digital logic dies connected through inductive coupling channels. Evaluation of a prototype module revealed radiation noise from the inductive coils to the image sensor is less than 0.4-LSB range along with ADC code, i.e., negligible. Aiming at high frame rate image sensor/processing module exploiting this attractive off-die interface, 1,000 fps motion vector (MV) estimation and classification engine for high-speed computational imaging in a 3D stacked module is assembled, and also tested. The module achieved a cognitive classification scheme employed on MV patterns, enabling the classification of moving objects not possible in conventional proposals.