Advances in Design and Test of Monolithic 3-D ICs

Arjun Chaudhuri,Sanmitra Banerjee,Heechun Park,Jinwoo Kim,Gauthaman Murali,Edward Lee,Daehyun Kim,Sung Kyu Lim,Saibal Mukhopadhyay,Krishnendu Chakrabarty

IEEE Design & Test（2020）

引用 7|浏览92

暂无评分

摘要

Monolithic 3-D (M3D) technology enables unprecedented degrees of integration on a single chip. The miniscule monolithic intertier vias (MIVs) in M3D are the key behind higher transistor density and more flexibility in designing circuits compared to conventional through silicon via (TSV)-based architectures. This article presents a comprehensive design and test techniques for emerging M3D-enabled circuits and systems.

查看译文

关键词

monolithic 3D,MIV,EDA,Shrunk-2D,design-for-test,BIST,resistive defect,ReRAM,ReRAM compiler,design-space exploration

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要