R2R Nano-patterning Technology Using 250 mm-wide Seamless Roller Mold

Kazuma Komatsu,Masayuki Abe, Naoto Ito,Shinji Matsui

2019 International Conference on Electronics Packaging (ICEP)(2019)

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摘要
For the future electronics devices, like flexible electronics, Asahi-Kasei has been developing SRM fabrication technology. We got fine and accurate patterns on the roller surface by development applied process of conventional EB lithography, named rEBL process. This paper shows the detail of rEBL process. And we developed some patterning process for transfer the pattern of the roller to plastic substrates. We demonstrated some patterns on the substrates. We also show the example of flexible electronics devices, Transparent Conductive Film by using this patterning process.
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关键词
Printing,Flexible electronics,Thin film transistors,Surface treatment,Fabrication,Conductive films,Throughput
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