Removing epoxy underfill between neighbouring components using acid for component chip-off

In addition to traditional high temperature eutectic soldering, the use of underfill epoxy to glue the electronic components to the PCB (memory, CPU, cryptographic chips) has now become the norm among mobile phone manufacturers, e.g. Apple, BlackBerry and Samsung. Currently, this technique is the best solution to protect components against various mechanical stresses and improve reliability. Unfortunately, traditional techniques (chip-off or lapping) have become impossible to apply to underfilled components without destroying them or without moving peripheral electronic components. These component movements make the board unusable or require many hours of expensive repairs and specific hardware.