Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications

2018 IEEE International Conference on Computational Electromagnetics (ICCEM)（2018）

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摘要

Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.

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关键词

Green's function,multi-layer dielectrics,loss,3D IC

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