Effect of Thermal Cycle Loadings on Mechanical Properties and Thermal Conductivity of a Porous Lead-Free Solder Joint

This paper demonstrates to what extent the number of thermal cycles affects the mechanical properties as well as the thermal conductivity of a porous solder joint in an insulated-gate bipolar transistor discrete. The blind mode voids were used for a finite-element method (FEM) simulation to obtain the results close to the actual conditions. The FEM results indicate that the concentration of creep ...