Effect of B4C and SiO2 on Bond Property for Phenolic Resin-Based Adhesive

In this paper, the modified phenolic resin-based adhesive was prepared by dissolving different components. After low temperature curing, SiC samples were bonded by the binder. The samples were treated at different temperatures (400°C, 800°C, 1200°C, 1500°C) under an inert atmosphere. The bonding strength of samples was tested after heat treatment at room temperature. The results showed that the bonding strength of the B4C modified phenolic resin (PF) based adhesive is the highest. When the heat treatment temperature was above 1200°C, the bond strength increased with the additive amount of boron carbide at room temperature. The microstructures of the samples were observed by optical microscope and scanning electron microscope. The effects of the modified filler and heat treatment temperature on the bonding strength of the phenolic resin based adhesive were investigated. The bonding strength of boron carbide-modified phenolic resin-based binder was tested under high temperature. It was found that the bond strength at high temperature was lower than that at room temperature, and the bond strength decreased with the increase of temperature.