Prepare the way to manufacture a patternable metallized substrate for W-UFEA by use of a DIBD

A new improved dual ion beam deposition method is introduced in which one can first clean the field emitter array matrix surface thoroughly through a 3�� low energy assisted ion beam bombardment source, then deposit metallized thin films sequentially through a 4�� focused ion beam deposition source. Enhanced film density and hardness has been achieved by the use of the bombardment of assisted source during deposition.