Conformal Peeling of Device-on-Substrate System in Flexible Electronic Assembly

Continuous peeling of thin chips and flexible devices from a donor to an acceptor is critical for high-efficiency roll-to-roll (R2R) manufacturing of flexible electronics. Here, we propose an R2R conformal peeling technique for the flexible device-on-substrate electronic assembly. First, a mechanical model is established for flexible multilayer structures conformed on curved surface, such as peeli...