Development of a Process Signature for Manufacturing Processes with Thermal Loads

The newly proposed concept of Process Signatures enables the comparison of seemingly different manufacturing processes via a process-independent approach based on the analysis of the loading condition and resulting material modification. This contribution compares the recently published results, based on numerically achieved data for the development of Process Signatures for sole surface and volume heatings without phase transformations, with the experimental data. The numerical approach applies the moving heat source theory in combination with energetic quantities. The external thermal loadings of both processes were characterized by the resulting temperature development, which correlates with a change in the residual stress state. The numerical investigations show that surface and volume heatings are interchangeable for certain parameter regimes regarding the changes in the residual stress state. Mainly, temperature gradients and thermal diffusion are responsible for the considered modifications. The applied surface- and volume-heating models are used in shallow cut grinding and induction heating, respectively. The comparison of numerical and experimental data reveals similarities, but also some systematic deviations of the residual stresses at the surface. The evaluation and final discussion support the assertion for very fast stress relaxation processes within the subsurface region. A consequence would be that the stress relaxation processes, which are not yet included in the numerical models, must be included in the Process Signatures for sole thermal impacts.