Effect of Additives on Bond Property for Phenolic Resin-Based Adhesive

Modified phenolic resin-based adhesive is used as the high temperature binder, which is prepared by adding different additives, zirconium diboride, boron carbide as modified fillers, and H3PO4, AlPO4 as curing agents. The influence of additives for phenolic resin-based adhesive on bond property of SiC ceramic was studied after heat treatment at 400 oC , 800 oC , 1200 oC , 1600 oC. The results show that the improvement of adhesion property for curing agents is not obvious. B4C modified phenolic resin-based adhesive exhibits better adhesion performance than ZrB2 modified phenolic resin-based adhesive. Bonding property of B4C modified phenolic resin-based adhesive is best at 1200 oC , and the adhesive strength is reduced above 1200 oC along with rising of the heat treatment temperature. Because of the formation of shrinkage micro-defects of phenolic resin, bond strength exists a sharp decline after 1200 oC heat treatment.