A Two-Level Undercut-Profile Substrate For Chemical-Solution-Based Filamentary Coated Conductors

A recently developed two-level undercut-profile substrate (2LUPS), containing two levels of plateaus connected by a curved wall with an undercut profile, enables self-forming filaments in a coated conductor during physical line-of-sight deposition of buffer and superconducting layers. In the present study, the 2LUPS concept is applied to a commercial cube-textured Ni-5at.% W tape, and the surface of the 2LUPS coated with two Gd2Zr2O7 buffer layers using chemical solution deposition is examined. Except for narrow regions near the edge of upper plateaus, the plateaus are found to be covered by strongly textured Gd2Zr2O7 buffer layers after dip coating and sintering.