TSF3D: MSV-driven Power Optimization for Application-Specific 3D Network-on-Chip

Kan Wang,SQ Dong, FX Jiao

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems(2017)

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摘要
Power consumption has become one of the major challenges in current chip design. One effective low power technology, multiple supply voltages (MSVs), has succeeded in 2D network-on-chip (NoC) design. However, few researches considered the MSV in 3D NoC, especially application-specific 3D NoC. In this paper, a complete three-stage synthesis flow for MSV-driven application-specific 3D NoC is propose...
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关键词
Three-dimensional displays,Optimization,Power demand,Switches,Through-silicon vias,Algorithm design and analysis,Network-on-chip
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