An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems(2016)
摘要
This paper presents a new transient electro-thermal simulation method for fast 3-D chip-level analysis of power electronics with field solver accuracy. The metallization stack and substrate are meshed and solved with 3-D field solver using nonlinear temperature-dependent electrical and thermal parameters, and the active transistors are modeled with table models to avoid time-consuming technology c...
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关键词
Transient analysis,Mathematical model,Capacitance,Approximation methods,Integrated circuit modeling,Logic gates,Thermal conductivity
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