Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems(2016)
摘要
At-speed testing of deep-submicrometer or nano-scale integrated circuits (ICs) consumes excessive power and creates hotspots and temperature gradient in the chip-under-test. The problem worsens for 3-D ICs, where heat dissipation across layers is more unbalanced. These hotspots in a circuit often cause severe degradation of performance and reliability, as a rise in temperature can introduce an ext...
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关键词
Delays,Testing,Thermal analysis,Circuit faults,Computer architecture
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