Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contactsHiroaki Sato,Yukio Hashimoto,Yoshikuni Nakadaira,Norihito Masuda,Belgacem Haba,Ilyas Mohammed, Philip Dambergmag(2015)引用 22|浏览4暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要