A 4x12.5 Gb/S Cwdm Si Photonics Link Using Integrated Hybrid Silicon Lasers

Brian R Koch, A C Alduino,Ling Liao,Richard Jones,Mike Morse,Brian Kim, Weizen Lo,Juthika Basak,Haifeng Liu,Haisheng Rong, Mathew N Sysak,Christine Krause, Rushdy Saba,Dror Lazar, Lior Horwitz,Roi Bar,Stas Litski,Ansheng Liu, Kevin G Sullivan,Olufemi I Dosunmu, Neal Na,Tao Yin, Frederic Haubensack,Iwei Hsieh,John Heck, R W Beatty,Jock Bovington,Mario J Paniccia

2011 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)（2011）

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摘要

We demonstrate a 4 lambda x12.5Gbps Silicon Photonics CWDM link integrating all optical components, electronics, and packaging technologies required to form the link. (C) Optical Society of America

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关键词

wavelength division multiplexing,electronics packaging,silicon photonics,si,photonic integrated circuits,photonics,packaging technology,semiconductor lasers,silicon

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