Simulation Studies On Bipolar Electrostatic Chucks

Chih-Hung Li,Yi-Fan Chiu, Yi-Hsiuan Yu,Jian-Zhang Chen

2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)（2015）

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摘要

We use Comsol Multiphysics, a finite element simulation tool to study a bipolar electrostatic chuck (E-chuck). The influences of the substrate and dielectric types, wafer thickness, and air gap are investigated.

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关键词

atmospheric modeling,force,dielectric constant,electrostatics

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