A Rigorous Approach for the Modeling of Through-Silicon-Via Pairs Using Multipole Expansions

Xiaomin Duan,David Dahl,Ivan Ndip,Klausdieter Lang,Christian Schuster

IEEE Transactions on Components, Packaging and Manufacturing Technology（2016）

引用 7|浏览3

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摘要

This paper presents a novel multipole expansion method for the rigorous analysis of wave propagation along a through-silicon-via (TSV) pair. TSV models are often constructed using equivalent circuits under the assumption that the interfaces between different media are equipotential. In comparison with that, the proposed method is a rigorous full-wave solution of the propagation mode. It takes adva...

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关键词

Silicon,Substrates,Through-silicon vias,Metals,Integrated circuit modeling,Equivalent circuits,Permittivity

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