Latent fingerprint enhancement on conductive substrates using electrodeposition of copper

We present a novel method for the development of a latent fingerprint by selective electrodeposition of a copper thin film from sulfate solution onto the conductive substrate between fingerprint ridges to generate a negative image of the fingerprint deposit. After optimizing the parameters (deposition time, deposition potential, and copper concentration), the preferential electrodeposition of copper films allowed latent fingerprints on six kinds of conductive surfaces (indium/tin oxide-coated glass, silver sheet, platinum sheet, gold sheet, copper sheet, and a stainless steel coin) to be successfully developed with high resolution. In addition, this technique could also be exploited to visualize latent fingerprints on rough and dirty surfaces. The quality of the developed fingerprints was estimated visually and the morphology of the copper film was characterized by field emission scanning electron microscopy.