Smv Methodology Enhancements For High Speed I/O Links Of Socs
VLSI Test Symposium(2014)
摘要
This paper presents an enhanced methodology to validate High Speed I/O links. The methodology outlines a stress method selection process, statistical techniques to optimize volume data collection as well as a method to determine when to perform UPM calculations.
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关键词
System-on-Chip,Post-Silicon Electrical Validation,System Marginality Validation,High Speed I/O,Unit per Million
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