Smv Methodology Enhancements For High Speed I/O Links Of Socs

VLSI Test Symposium(2014)

引用 10|浏览21
暂无评分
摘要
This paper presents an enhanced methodology to validate High Speed I/O links. The methodology outlines a stress method selection process, statistical techniques to optimize volume data collection as well as a method to determine when to perform UPM calculations.
更多
查看译文
关键词
System-on-Chip,Post-Silicon Electrical Validation,System Marginality Validation,High Speed I/O,Unit per Million
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要