Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module.
IEEE Journal of Solid-State Circuits(2014)
摘要
This work describes the circuit and physical design implementation of the processor chip (CP), level-4 cache chip (SC), and the multi-chip module at the heart of the EC12 system. The chips were implemented in IBM's high-performance 32nm high-k/metal-gate SOI technology. The CP chip contains 6 super-scalar, out-of-order processor cores, running at 5.5 GHz, while the SC chip contains 192 MB of eDRAM...
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关键词
Clocks,Integrated circuit modeling,Arrays,Hardware,Delays,Reliability engineering
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