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Wen-Yan Yin (Fellow, IEEE) received the M.S. degree in electromagnetic fields and microwave techniques from the Xidian University, Xi'an, China, in 1989, and the Ph.D. degree in electrical engineering from the Xi'an Jiao Tong University, Xi'an, China, in 1994.
From 1993 to 1996, he was an Associate Professor with the Department of Electronic Engineering, Northwestern Polytechnic University, Xi'an, China. From 1996 to 1998, he was the AvH Research Fellow with the Department of Electronic Engineering, Duisburg University, Germany. Since December 1998, he has been with the National University of Singapore, Singapore, as a Research Scientist. From 2005 to 2008, he was a Professor with the School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China, where he is currently an adjunct Ph.D. candidate supervisor with the Center for Microwave and RF Technologies. Since January 2009, he has been with the Zhejiang University (ZJU), Hangzhou, China, as a “Qiu Shi” Distinguished Professor. He is currently the director of the Innovative Institute of Electromagnetic Information and Electronic Integration, College of Information Science and Electronic Engineering, ZJU. As a leading author, he has authored or coauthored more than 260 international journal papers (more than 160 IEEE papers), including 1 international book and several book chapters. His main research interests include EMC and EM protection of communication platforms, computational electromagnetics and multiphysics and their applications, and nanoelectronics, 3D IC, and advanced packaging.
Dr. Yin is the Associate Editor for the IEEE Transaction on Components, Packaging, and Manufacturing Technology and the Associate Editor of IEEE Journal of Multiscale and Multiphysics Computational Techniques. From 2011 to 2012, he was an IEEE EMC Society Distinguished Lecturer. From 2013 to 2016, he was the IEEE EMC Society Chapter Chair. From 2011 to 2016, he was an Associate Editor of the International Journal of Electronic Networks, Devices, and Fields. He was also an editorial board member of International Journal of RF and Microwave Computer-Aided Engineering from 2012 to 2014. He is the General Co-Chair of the 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (IEEE EDAPS’ 2017), sponsored by the IEEE Electronic Packaging Committee. He was also the technical chair of EDAPS’ 2006 and 2011, respectively. He is the recipient of Science and Technology Progress Award of the First Class from the local Shanghai Government of China in 2005 and 2011, respectively, the National Technology Invention Award of the Second Class from the Chinese Government in 2008, the Science and Technology Progress Award of the Second Class of China in 2012, the Defense Technology Invention Award of the Second Class of China in 2015, and several best paper awards of the international conferences.
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2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
2017 International Applied Computational Electromagnetics Society Symposium (ACES)pp.1-2, (2017)
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