基本信息
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职业迁徙
个人简介
Research Interests:
CAD for VLSI, Design Automation
Mixed-Domain and Multi-Physics Modeling/Simulation Algorithms
Parallel Circuit/EM/RF Simulation Algorithms
Signal and Power Integrity Modeling/Analysis Methods
Co-Performance Modeling/Analysis for Chip, Package and Systems
Modeling and Simulation of High-Speed Interconnects
Model-Order Reduction Techniques
Design Tools for RF, Wireless, MEMS and Optoelectronic Applications
Electromagnetic Compatibility (EMC/EMI) analysis of VLSI systems
Numerical Algorithms
CAD for VLSI, Design Automation
Mixed-Domain and Multi-Physics Modeling/Simulation Algorithms
Parallel Circuit/EM/RF Simulation Algorithms
Signal and Power Integrity Modeling/Analysis Methods
Co-Performance Modeling/Analysis for Chip, Package and Systems
Modeling and Simulation of High-Speed Interconnects
Model-Order Reduction Techniques
Design Tools for RF, Wireless, MEMS and Optoelectronic Applications
Electromagnetic Compatibility (EMC/EMI) analysis of VLSI systems
Numerical Algorithms
研究兴趣
论文共 71 篇作者统计合作学者相似作者
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2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023pp.159-162, (2023)
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.306-310, (2023)
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2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)pp.1-3, (2023)
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2023 IEEE/MTT-S International Microwave Symposium - IMS 2023pp.163-165, (2023)
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IEEE Transactions on Signal and Power Integrity (2022): 55-64
IEEE Journal on Multiscale and Multiphysics Computational Techniques (2022): 176-185
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2021): 1343-1354
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