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职业迁徙
个人简介
His current research is in the areas of materials and processing science for interconnect and packaging for microelectronics. He received the Outstanding Alumni Achievement Award from National Chengkung University in 1992, the Michel Lerme Award from the International Interconnect Technology Conference in 1999 and the Thomas D. Callinan Award from the Electrochemical Society in 2001. He holds the inventorship of 15 U.S. Patents in microelectronics technology. He has edited six books and published extensively in the area of thin films and materials science for microelectronics. He is a Fellow of the American Physical Society, the American Vacuum Society and IEEE.
研究兴趣
论文共 385 篇作者统计合作学者相似作者
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.127-202, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.338-379, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.34-79, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.80-126, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.251-337, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.XI-XIII, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.203-250, (2022)
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ELECTROMIGRATION IN METALS: Fundamentals to Nano-Interconnectspp.1-7, (2022)
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crossref(2022)
Fundamentals of Electromigration-Aware Integrated Circuit Designpp.8-33, (2022)
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