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INTERNATIONAL JOURNAL OF THERMAL SCIENCES (2024): 108741-108741
Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun Li,Hongying Li,Duc Vinh Le,Jing Lou
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2024): 397-405
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong, Keng Yuen Jason Au,King Jien Chui,Jing Lou,Hongying Li,Duc Vinh Le
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1964-1968, (2023)
Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun Li,Hongying Li,Duc Vinh Le,Jing Lou
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1012-1016, (2023)
Huicheng Feng,Gongyue Tang,Xiaowu Zhang,Boon Long Lau,Ming Chinq Jong, King Jien Chui,Jing Lou,Hongying Li,Duc Vinh Le
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.880-884, (2022)
Ocean Engineering (2022): 110549-110549
Li Hongying, Pan Lunsheng,Lou Jing, Zhang Xiaowu,Le Ducvinh,Cheng Ming, Li Jun, Kang Chang Wei, Chui King Jien, Feng Huicheng
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)pp.1-5, (2022)
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