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Dr. Murmann was a co-recipient of the Best Student Paper Award at the 2008 and 2021 VLSI Circuits Symposia, as well as a recipient of the Best Invited Paper Award at the 2008 IEEE Custom Integrated Circuits Conference (CICC). He received the 2009 Agilent Early Career Professor Award, the 2012 Friedrich Wilhelm Bessel Research Award by the Humboldt Foundation, and the 2021 SIA-SRC University Researcher Award for lifetime research contributions to the U.S. semiconductor industry.
His research interests are in the area of mixed-signal integrated circuit design. Specific topics include sensor interfaces, A/D and D/A conversion, high-speed communication links, embedded machine learning (tinyML) as well as open-source chip design.
Dr. Murmann is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He has served as an Associate Editor of the IEEE Journal of Solid-State Circuits, an AdCom member and Distinguished Lecturer of the IEEE Solid-State Circuits Society (SSCS), the Data Converter Subcommittee Chair and Technical Program Chair of the IEEE International Solid-State Circuits Conference (ISSCC), Technical Program Co-Chair the IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) and the tinyML Research Symposium, as well as General Co-Chair of the IEEE International Symposium on Circuits and Systems (ISCAS). He currently chairs the IEEE SSCS Technical Committee on the Open-Source Ecosystem.
His research interests are in the area of mixed-signal integrated circuit design. Specific topics include sensor interfaces, A/D and D/A conversion, high-speed communication links, embedded machine learning (tinyML) as well as open-source chip design.
Dr. Murmann is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He has served as an Associate Editor of the IEEE Journal of Solid-State Circuits, an AdCom member and Distinguished Lecturer of the IEEE Solid-State Circuits Society (SSCS), the Data Converter Subcommittee Chair and Technical Program Chair of the IEEE International Solid-State Circuits Conference (ISSCC), Technical Program Co-Chair the IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) and the tinyML Research Symposium, as well as General Co-Chair of the IEEE International Symposium on Circuits and Systems (ISCAS). He currently chairs the IEEE SSCS Technical Committee on the Open-Source Ecosystem.
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IEEE Journal of Solid-State Circuitsno. 99 (2024): 1-12
Advanced Functional Materialsno. 1 (2023)
IEEE Journal of Solid-State Circuitsno. 6 (2023): 1508-1518
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IEEE Access (2023): 41205-41217
IEEE Transactions on Electron Devicesno. 5 (2023): 2247-2254
Moonhyung Jang,Maddy Hays,Wei-Han Yu,Changuk Lee,Pietro Caragiulo, Athanasios T. Ramkaj,Pingyu Wang, A. J. Phillips,Nicholas Vitale,Pulkit Tandon,Pumiao Yan,Pui-In Mak,
IEEE JOURNAL OF SOLID-STATE CIRCUITS (2023)
ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC)pp.469-472, (2023)
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