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Available projects are in areas that include, but are not limited to: (1) VLSI physical design, (2) challenges at the VLSI design-manufacturing interface, (3) machine learning applications related to IC design and EDA, (4) technology extrapolation and system roadmapping / pathfinding, (5) challenges of margin and cost reduction at advanced nodes (signoff definition, model-hardware correlation, physical design methodologies at N3 node, etc.), and (6) research on open-source EDA to support the vision of the OpenROAD project. Research is supported by NSF, DARPA, industry sponsors, and the C-DEN center.
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论文共 836 篇作者统计合作学者相似作者
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AAAI 2024no. 12 (2024): 13022-13030
Proceedings of the 2024 International Symposium on Physical Design (2024)
CoRRno. 99 (2023): 1-1
IEEE Design & Testno. 1 (2023): 8-16
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